wafer.space End User Documentation

• Useful Resources
  • GF180MCU PDK Resources
    • Official Documentation
    • Design Tools
    • Simulation and Verification
  • wafer.space Resources
    • Official Links
    • Community and Support
  • Educational Resources
    • Tutorials and Courses
    • Example Designs
    • Design Guides
  • Community Projects and Tools
    • Open Source EDA Tools
    • Verification and Testing
  • Getting Help
    • Forums and Communities
    • Documentation and References
  • Manufacturing Resources
    • Packaging and Assembly
    • Testing and Characterization
• Packaging Your wafer.space Chips
  • What You Receive from wafer.space
  • Packaging Responsibility
  • Packaging Options Overview
    • 1. Chip-on-Board (COB) - Recommended Starting Point
    • 2. Using Bare Die Directly
    • 3. Traditional IC Packaging (Future)
  • Choosing the Right Packaging Approach
  • Getting Started
  • Section Contents
    • Chip-on-Board (Using Wire Bonding)
    • Using Bare Die Directly
  • Glossary
  • Need Help?
• Community Documentation
  • What is Community Documentation?
  • Browse Community Content
    • Contributing to Community Documentation
    • Case Studies
    • Tips and Tricks
    • Workflows
    • Troubleshooting
    • Success Stories
  • Recent Contributions
    • Latest Additions
  • Why Contribute?
  • Getting Started
  • Community Guidelines
  • Disclaimer
  • Questions or Feedback?